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Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1

Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1
Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1 Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1 Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1
Basic Information
Place of Origin: China
Brand Name: YL
Model Number: YCGP-1
Minimum Order Quantity: 1 set
Price: Negotiable
Packaging Details: Standard export plywood case
Delivery Time: 25-35 days
Payment Terms: T/T, Western Union, MoneyGram, Western Union
Supply Ability: 5 sets per quarter
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Detail Information
Power Supply: AC220V 50/60 HZ Main Power: Around 1.0 KW
Speed: 9000~12000chips/hour( 2 Times Of Hot Welding) Air Comsupmtion: Around 30L/min
Control Mode: PLC+stepper System Operator Needed: 1 Person
Highlight:

IC Chip Glue Tape Lamination Machine

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Contact IC Glue Tape Lamination Machine

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Glue Tape Lamination Machine PLC Controlled

Product Description

Contact IC Chip Tape Glue Preparation Machine Automatically Controlled YCGP-1
Key Specifications
Attribute Value
Power Supply AC220V 50/60 HZ
Main Power Around 1.0 KW
Speed 9000~12000chips/hour (2 times of hot welding)
Air Consumption Around 30L/min
Control Mode PLC+stepper system
Operator Needed 1 person
Product Overview
This PLC-controlled machine uses imported high-quality stepper motors to transport IC module strips and hot melt glue for precise glue preparation. It offers fast production speed and high precision, suitable for various contact IC chip or module tapes (including 6-pin and 8-pin chips).
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive application, glue flushing, hot welding, and finished product collection
  • Automatic correction and balance structure design for better glue preparation results
  • Position fine-tuning mechanism for higher punching precision
  • Modular design for easy mold replacement when processing different IC modules
  • Automatic monitoring with electric sensor eye for position accuracy
  • Automatic material feeding and discharge with alarm system
Technical Parameters
Power AC220V 50/60 HZ
Main Power Around 1.0 KW
Compressed Air 6kg/cm² (dry oil free)
Air Consumption Around 30L/min
Net Weight Around 400Kg
Control Mode PLC+stepper system
Speed 9000~12000chips/hour (2 times hot welding)
15000~18000chips/hour (1 time hot welding)
Bonding Mode Hot melt glue (like Tesa 8410, Scapa G175 or similar)
Module Specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine Size Around L1700×W800×H1600mm
Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1 0
Additional Information
Also known as: Contact IC Chip Glue Applicator, Contact IC Card Machine, IC Chip Tape Glue Pastor, IC Card Machine
Packing: PE film protection inside, standard export plywood case outside
Our Service
Pre-sale Services:
  • Professional suggestions and feasibility analysis
  • Device model recommendation
  • Efficient on-line service
  • Factory visit arrangements
Sales Services:
  • Production scheduling updates
  • Quality supervision
  • Product acceptance
  • Timely shipping
After-sale Services:
  • On-site installation guidance
  • Setup and operation training
  • Lifetime technical support
  • Regular customer follow-up
Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1 1
Warranty
1-year guarantee: Includes efficient service support and potential on-site assistance for unsolvable issues within the warranty period.
Contact IC Chip Glue Tape Lamination Machine PLC Controlled YCGP-1 2

Tag:

Data Personalization Machine,

Card Laser Engraving Machine,

SIM Card Packing Machine

Contact Details
karlb
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