Name: PLC Control Contact Card Production Line IC Module Automatic Glue Tape Lamination Machine
Brand: YL Electrical Equipment (Tianjin) Co., Ltd.
SKU: YCGP-1
Availability: InStock

Detail Information

Power:	Around 1.0kw	Power Supply:	AC220V 50/60 HZ
Compressed Air:	6kg/cm²（dry Oil Free）	Spped 1:	9000~12000chips/hour( 2 Times Of Hot Welding)
Spped 2:	15000~18000chips/hour( 1 Time Of Hot Welding)	Module Specification:	ISO Standard Contact IC Card Chip Tape (M3/8-pin & M2/6-pin）
Highlight:	PLC Contact Card Production Line , Auto Contact Card Production Line , Automatic Glue Tape Lamination Machine

Product Description

Contact IC Chip Tape Glue Preparation Machine for 6 Pin Chip And 8 Pin Chip

Product Specifications

Attribute	Value
Power	Around 1.0kW
Power supply	AC220V 50/60 HZ
Compressed air	6kg/cm² (dry oil free)
Speed 1	9000~12000 chips/hour (2 times of hot welding)
Speed 2	15000~18000 chips/hour (1 time of hot welding)
Module specification	ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)

Product Overview

The YCGP-1 Contact IC Chip Tape Glue Preparation Machine features PLC program automatic control and uses imported high-quality stepper motors for precise glue preparation with fast production speed and high precision.

Key Features

Integrated system for IC module strip transportation, hot melt adhesive application, and finished product collection
Hot welding glue preparation welding head features automatic correction and balance structure design for better results
Position fine-tuning mechanism for higher punching precision and easier operation
Modular design allows easy replacement for different IC module types
Automatic monitoring with electric sensor eye for position protection
Automatic material feed and discharge with alarm system

Technical Parameters

Power	AC220V 50/60 HZ
Main Power	Around 1.0 KW
Compressed air	6kg/cm² (dry oil free)
Air consumption	Around 30L/min
Net Weight	Around 400Kg
Control mode	PLC + stepper system
Speed	9000~12000 chips/hour (2 times hot welding) 15000~18000 chips/hour (1 time hot welding)
Operator	1 person
Bonding mode	Hot melt glue (like Tesa 8410, Scapa G175 or similar)
Module specification	ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine size	Around L1700×W800×H1600mm

Applications

The YCGP-1 is designed for preparation and processing of various contact IC chip or module tapes, including 6-pin chip and 8-pin chip configurations.

Tag:

Place of Origin:	China
Brand Name:	YL
Model Number:	YCGP-1

Minimum Order Quantity:	1 set
Price:	negotiable
Packaging Details:	1 plywood case
Delivery Time:	30-35days
Payment Terms:	T/T, Western Union, MoneyGram
Supply Ability:	1 set per 35 days

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